Our Services

Our services span engineering design to reverse engineering, package assembly to testing, and qualification to reliability. We refine intricate semiconductor technologies into nimble and effective alternatives.

Engineering Design

Circuit Design

Crafting a detailed schematic to arrange and intricately interconnect components for specific electronic functionality.

Schematic Design

Creating a simplified, standardized visual representation of electronic circuit interconnections and components.

System-On-Chip Design

Consolidating various electronic functionalities onto a single semiconductor substrate enhances integration for advanced power systems.

Integrated Circuit Design

Strategically positioning power electronic components on a semiconductor substrate to construct a refined, operational, and space-efficient power circuit.

CubeSat Integration

Dive into a world where precision meets innovation, and every electronic component tells a tale of perfection.

Reverse Engineering


Unveiling the gallium oxide substrate of power electronic components by extracting them from their protective encapsulation for subsequent analysis.

Functional Analysis

Understanding how data is processed and flows through a power electronic component's circuitry reveals its operational logic and purpose.

Reverse Synthesis

Understanding how power is processed and flows through a power electronic component's circuitry unveils its operational logic and purpose.

Reverse Engineering

Empower your space endeavors with our premier radiation-hardened solutions, setting the stage for pioneering advancements in satellite technology.

Package Assembly

Die Attachment

Utilizing a soldering compound in power electronic components secures the bonding of a gallium oxide epitaxial layer to a substrate or lead frame.

Bonding Process

Initiate the bonding procedure by thermally activating the assembly to instigate the chemical reaction of the bonding agent, applying tailored mechanical force to optimize interfacial adhesion between the gallium oxide epitaxial layer and the substrate.

Lead Formation

Shaping and configuring the leads or pins on power electronic components facilitates easy integration and connection with external circuits on a circuit board.

Package Assembly

Power your space ambitions with state-of-the-art MOSFETs and Diodes, laying the foundation for groundbreaking satellite missions.


Radiation Testing

Testing encompasses subjecting these devices to diverse radiation sources to evaluate their operational robustness and reliability in radiation-rich environments.

Wafer Testing

ATE assesses the electrical attributes of individual electronic components on a wafer before disjunction and encapsulation.

Burn-In Testing

Devices undergo accelerated testing in demanding conditions to unveil latent defects, fortifying electronic components' long-term reliability and stability.

Scanning Electron Microscopy (SEM)

High-resolution imaging is used for detailed analysis of the physical structure of electronic components, helping identify defects at the microscopic level.


Empower your space missions with rigorous testing, guaranteeing operational excellence beyond the atmosphere.


Design Qualification

Evaluate the design compliance with specifications and requirements.

Operational Qualification

Verify that the equipment operates according to specifications.

Performance Qualification

Conduct tests under normal operating conditions, analyze results, and assess reliability.

Product Qualification

Execute extensive testing of manufactured devices, ensuring they meet quality and performance standards.

Package Assembly

Unleashing Ingenuity through Advanced Microcontrollers and Configurable Logic Devices for pioneering Satellite Expeditions.


Design for Reliability (DFR)

Evaluate potential failure modes, assess stress factors, and implement design features to enhance reliability.

Accelerated Life Testing (ALT)

Subject devices to elevated temperatures, voltage, and stress levels to accelerate aging and assess long-term reliability.

Failure Analysis

Analyze failed devices using techniques like microscopy and spectroscopy to identify failure mechanisms.

Field Reliability Monitoring

Analyze data from devices deployed in the field to validate and improve reliability models.


Propel Your Celestial Ambitions with Our State-of-the-Art Advanced Microprocessors and Electrodynamic Tether.

NAICS CodeIndustry
334413Semiconductor And Related Device Manufacturing
334419Other Electronic Component Manufacturing
334517Irradiation Apparatus Manufacturing
335999All Other Miscellaneous Electrical Equipment and Component Manufacturing
541330Engineering Services
541713Research And Development In Nanotechnology
541715Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
Connect With Us